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Integrated Passive Component Technology

Integrated Passive Component Technology


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International Edition


About the Book

  • This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.
  • Describes the processes available for creating integrated passives, measuring their properties, and applying them.
  • Brings reader up to date in a fast-moving technology.
  • Enables reader to implement the technology into a manufacturing environment.
  • Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
  • Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.

About the Author: RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society's Dielectric Science and Technology Division.

LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.


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Product Details
  • ISBN-13: 9780471244318
  • Publisher: Wiley-IEEE Press
  • Publisher Imprint: Wiley-IEEE Press
  • Depth: 0.25
  • Language: English
  • Returnable: N
  • Spine Width: 24 mm
  • Width: 162 mm
  • ISBN-10: 0471244317
  • Publisher Date: 30 Jun 2003
  • Binding: Hardback
  • Height: 242 mm
  • No of Pages: 379
  • Series Title: English
  • Weight: 788 gr


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