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Asic/Soc Functional Design Verification

Asic/Soc Functional Design Verification


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About the Book

Chapter 1.Introduction.- Chapter 2.Functional Verification- Challeenges and Solution.- Chapter 3.SystemVerilog Paradigm.- Chapter 4. UVM.- Chapter 5.CRV.- Chapter 6.SVA.- Chapter 7.SFC.- Chapter 8.CDC.- Chapter 9.Low Power Verification.- Chapter 10. Static Verification.- Chapter 11.ESL.- Chapter 12. Hardware/Software Co-verification.- Chapter 13.- Analog Mixed Signals Verification.- Chapter 14.- SOC Interconnect Verification.- Chapter 15. The Complete Product Design Lifecycle.- Chapter 16. Voice Over IP.- Chapter 17. Cache Memory Subsystem Verification: UVM Agent Based.- Chapter 18. Cache Memory Subsystem Verification: ISS Based.


About the Author:

Ashok Mehta has been working in the ASIC/SoC design and verification field for over 20 years. He started his career at Digital Equipment Corporation (DEC) working as a CPU design engineer. He then worked at Data General, Intel (first Pentium Architecture Verification team) and after a route of couple of startups, worked at Applied Micro and currently at TSMC.

He was a very early adopter of Verilog and participated in Verilog, VHDL, iHDL (Intel HDL) and SDF (standard delay format) technical subcommittees. He has also been a proponent of ESL (Electronic System Level) designs. At TSMC he architected and went into production with two industry standard TSMC ESL Reference Flows that take designs from ESL to RTL while preserving the verification environment for reuse from ESL to RTL.

He holds 14 U.S. Patents in the field of SoC and 3DIC design verification.

He is also the author of Second Edition of the book "SystemVerilog Assertions and Functional Coverage - A comprehensive guide to languages, methodologies and applications". Springer (June 2016).

Ashok earned an MSEE from University of Missouri.

In his spare time, he is an amateur photographer and likes to play drums on 70's rock music driving his neighbors up the wall J


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Product Details
  • ISBN-13: 9783319594170
  • Publisher: Springer
  • Publisher Imprint: Springer
  • Edition: 1st ed. 2018
  • Language: English
  • Returnable: Y
  • Sub Title: A Comprehensive Guide to Technologies and Methodologies
  • Width: 156 mm
  • ISBN-10: 3319594176
  • Publisher Date: 07 Jul 2017
  • Binding: Hardback
  • Height: 234 mm
  • No of Pages: 328
  • Spine Width: 21 mm
  • Weight: 734 gr


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