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Alloying Modification of Low-Ag-Content Sn-Ag-Cu Solders

Alloying Modification of Low-Ag-Content Sn-Ag-Cu Solders


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About the Book

Sn-Ag-Cu (SAC) alloy is currently recognized as the standard lead-free solder alloy for packaging of interconnects in the electronics industry, and high- Ag-content SAC alloys are the most popular choice. However, this choice has been encumbered by the fragility of the solder joints that has been observed in drop testing as well as the high cost of the Ag itself. Therefore, low-Ag-content SAC alloy was considered as a solution for both issues. However, this approach may compromise the thermal-cycling performance of the solders. Therefore, to enhance the thermal-cycling reliability of low-Ag-content SAC alloys without sacrificing their drop-impact performance, alloying elements such as Mn, Ce, Ti, Bi, In, Sb, Ni, Zn, Al, Fe, and Co were selected as additions to these alloys. However, research reports related to these modified SAC alloys are limited. To address this paucity, the present study reviews the effect of these minor alloying elements on the solder joint reliability of low-Ag-content SAC alloys in terms of thermal cycling and drop impact.


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Product Details
  • ISBN-13: 9783639763782
  • Publisher: Scholars' Press
  • Binding: Paperback
  • Language: English
  • Returnable: N
  • Spine Width: 9 mm
  • Width: 152 mm
  • ISBN-10: 3639763785
  • Publisher Date: 23 Apr 2015
  • Height: 229 mm
  • No of Pages: 152
  • Series Title: English
  • Weight: 286 gr


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