Advanced materials for printed flexible electronics
Preface
1 Fundamentals and design guides for printed flexible electronics Abstract
1.1 Historical perspectives
1.2 Printing requirements for printable materials
1.2.1 Ink formulation
1.2.2 Inks for flexible devices 1.2.3 Inks for stretchable devices
1.2.4 Inks for self-healing devices
1.2.5 Polymer substrate formulation
1.3 Design guidelines for flexible printed electronics
1.3.1 3D modeling and printing process control
1.3.2 Design guideline for 3D printing
1.3.3 Materials design for flexible and stretchable electronics
1.4 Fabrication technology for printed flexible electronics
1.4.1 Nozzle-based 3D printing technologies
1.4.2 Light-based 3D writing technologies
1.4.2.1 Two-photon lithography
1.4.2.2 Projection micro-stereolithography
1.4.2.3 Continuous liquid interface production 1.4.3 Representative multi-material and hybrid 3D printing processes
1.4.4 Stress-controlled folding of 3D systems
1.4.4.1 4D printing
1.4.4.2 Micro- and nanoscale origami
1.4.4.3 Mechanically guided assembly References
Exercises
2 Process and material characterization in printed flexible electronics
Abstract 2.1 Fluid characterization
2.1.1 Rheology and wetting behavior
2.1.1.1 Viscosity
2.1.1.2 Surface energies and surface tensions 2.1.1.3 Viscoelasticity
2.1.1.4 Direct imaging
2.1.1.5 Dynamic measurements
2.1.2 Jet breakup and drop formation
2.1.3 Characteristics of jet fluids with solid fillers
2.1.3.1 Rheology of particle suspensions
About the Author: Colin Tong is a materials expert with considerable professional experience in the past two decades. His research & development activities and industrial practices cover a broad range of different fields with a special focus on materials testing and characterization, component design and processing of advanced composite materials, metallurgy, thermal management of electronic packaging, electromagnetic interference shielding, integrated optical waveguides, functional metamaterials and metadevices, energy materials, as well as flexible and printed electronics. He holds a Ph.D. degree in Materials Science and Engineering, and a Master's as well as a Bachelor's degree in Materials and Mechanical Engineering. Dr. Tong has published five books, over 30 peer-reviewed papers, and he holds 9 patents. He is a senior member of IEEE (Institute of Electrical and Electronics Engineers). He received the Henry Marion Howe Medal from ASM International for his contribution to research and development on advanced aluminum composite materials in 1999.
