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Wensheng Zhao

Wensheng Zhao

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1.
Advanced Interconnect and Packaging
Advanced Interconnect and Packaging
By: Wensheng Zhao
Publisher: Mdpi AG
No Review Yet
AED733
Binding:
Hardback
Release:
20 Feb 2023
Language:
English
International Edition
Ships within 22-24 Days Explain..
Free Shipping in UAE.
2.
Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore
Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore
By: Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao, Faxing (Institute of Microelectronics (IME), Agency for Science, Technology and Research (A-STAR), Singapore) Che
Publisher: Woodhead Publishing
No Review Yet
AED1,980
Binding:
Paperback
Release:
15 Nov 2019
Language:
English
International Edition
Ships within 26-28 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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