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1.
Electrothermal Analysis of VLSI Systems
Electrothermal Analysis of VLSI Systems
By: Sung-Mo (Steve) Kang, Chin-Chi Teng, Sung-Mo Kang, Ching-Han Tsai, Yi-Kan Cheng
Publisher: Springer
No Review Yet
AED502
Binding:
Paperback
Release:
20 Apr 2013
Language:
English
International Edition
Ships within 14-16 Days Explain..
2.
Electrothermal Analysis of VLSI Systems
Electrothermal Analysis of VLSI Systems
By: Sung-Mo (Steve) Kang, Chin-Chi Teng, Sung-Mo Kang, Ching-Han Tsai, Yi-Kan Cheng
Publisher: Springer
No Review Yet
AED390
Binding:
Hardback
Release:
30 Jun 2000
Language:
English
Available
Ships within 1-2 Days Explain..
3.
Modeling of Electrical Overstress in Integrated Circuits
Modeling of Electrical Overstress in Integrated Circuits
By: Sung-Mo (Steve) Kang, Charvaka Duvvury, Carlos H Diaz
Publisher: Springer
No Review Yet
AED717
Binding:
Paperback
Release:
27 Sep 2012
Language:
English
International Edition
Ships within 14-16 Days Explain..
4.
Physical Design for Multichip Modules
Physical Design for Multichip Modules
By: Sung-Mo (Steve) Kang, Mysore Sriram
Publisher: Springer
No Review Yet
AED717
Binding:
Paperback
Release:
08 Oct 2012
Language:
English
International Edition
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5.
Design Automation for Timing-Driven Layout Synthesis
Design Automation for Timing-Driven Layout Synthesis
By: Sung-Mo (Steve) Kang, S Sapatnekar
Publisher: Springer
No Review Yet
AED722
Binding:
Paperback
Release:
04 Oct 2012
Language:
English
International Edition
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6.
Hot-Carrier Reliability of Mos VLSI Circuits
Hot-Carrier Reliability of Mos VLSI Circuits
By: Sung-Mo (Steve) Kang, Yusuf Leblebici
Publisher: Springer
No Review Yet
AED986
Binding:
Paperback
Release:
27 Sep 2012
Language:
English
International Edition
Ships within 14-16 Days Explain..
7.
Modeling of Electrical Overstress in Integrated Circuits
Modeling of Electrical Overstress in Integrated Circuits
By: Sung-Mo (Steve) Kang, Charvaka Duvvury, John Donoghue, Carlos H Diaz, Lorenzo Sorbo
Publisher: Springer
No Review Yet
AED707
Binding:
Hardback
Release:
30 Nov 1994
Language:
English
International Edition
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