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Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht

Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht

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1.
Handbook of Electronic Package Design
Handbook of Electronic Package Design
By: Pecht Pecht, Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Lynn (Battelle, Columbus, Ohio, USA) Faulkner, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis Inc
No Review Yet
AED2,212
Binding:
Hardback
Release:
16 Aug 1991
Language:
English
Available
Ships within 12-14 Days Explain..
Free Shipping in UAE.
2.
Product Reliability, Maintainability, and Supportability Handbook
Product Reliability, Maintainability, and Supportability Handbook
By: Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: CRC Press
No Review Yet
AED933
Binding:
Hardback
Release:
01 Apr 2009
Language:
English
Available
Ships within 9-10 Days Explain..
Free Shipping in UAE.
3.
Guidebook for Managing Silicon Chip Reliability
Guidebook for Managing Silicon Chip Reliability
By: Michael Pecht, Riko Radojcic, Gopal Rao, Michael G. Pecht, Michael (University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis Inc
No Review Yet
AED856
Binding:
Hardback
Release:
29 Dec 1998
Language:
English
Available
Ships within 9-10 Days Explain..
Free Shipping in UAE.
4.
Japanese Electronics Industry
Japanese Electronics Industry
By: Watura Nakayama, Wataru Nakayama, Michael Pecht, William Boulton, Michael (University of Maryland, College Park, USA) Pecht
Publisher: CRC Press
No Review Yet
AED777
Binding:
Paperback
Release:
27 Jun 1999
Language:
English
Available
Ships within 20-22 Days Explain..
Free Shipping in UAE.
5.
Electronics Industry in Taiwan
Electronics Industry in Taiwan
By: Chung-Shing Lee, Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Chung-Shing (Pacific Lutheran University, Tacoma, Washington, USA) Lee, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis
No Review Yet
AED2,025
Binding:
Hardback
Release:
18 Dec 2020
Language:
English
International Edition
Ships within 26-28 Days Explain..
Free Shipping in UAE.
6.
Placement and Routing of Electronic Modules
Placement and Routing of Electronic Modules
By: Michael Pecht, Michael (University of Maryland, College Park, USA) Pecht, Michael (University of Maryland, College Park, USA University of Maryland, College Park, USA) Pecht
Publisher: Taylor and Francis
No Review Yet
AED793
Binding:
Paperback
Release:
05 Sep 2019
Language:
English
International Edition
Ships within 26-28 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
7.
Japanese Electronics Industry
Japanese Electronics Industry
By: Wataru Nakayama, Michael Pecht, William Boulton, Michael (University of Maryland, College Park, USA) Pecht, Wataru (ThermTech International, Kanagawa, Japan) Nakayama
Publisher: CRC Press
No Review Yet
AED1,258
Binding:
Hardback
Release:
28 Jun 2018
Language:
English
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