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Jeffrey C Suhling

Jeffrey C Suhling

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1.
Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)
Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set)
By: Avram Bar-Cohen, Andrew Tay, Jeffrey C Suhling, Andrew A O Tay
Publisher: World Scientific Publishing Company
No Review Yet
AED7,273
Binding:
Hardback
Release:
18 Oct 2019
Language:
English
Available
Ships within 9-10 Days Explain..
Free Shipping in UAE.
2.
Mechanical Design of Electronic Systems
Mechanical Design of Electronic Systems
By: Pradeep Lall, James W Dally, Pradeep (Auburn University, Alabama, USA) Lall, Jeffrey C Suhling
Publisher: College House Enterprises, LLC
No Review Yet
AED1,213
Binding:
Paperback
Release:
23 Jan 2017
Language:
English
International Edition
Ships within 20-22 Days Explain..
Free Shipping in UAE.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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